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we utilize the ultra-precision machine tool of Switzerland to machine bar tungsten substrates.The circular arc at the positions of angles of the substrate is smaller than 15 um.
The tungsten base materials are not added with any lubricating agents or sintering addtives the production process so that the size precision and the thermal stability of our products can be ensured.The tungsten base material is in perfectly matched with the coefficient of the linear expansion and overcomes the effect of smile.
(heatsinks,heat spreader,laser diode submounts,optoelectronics packages,copper tunsten substrate,base plate,flange,chip carrier,optical bench)
semiconductor laser thermal layer bar substrate
